Insulated gate bipolar transistor (igbt) and related methods

ABSTRACT

An insulated gate bipolar transistor (IGBT) includes a gate trench, an emitter trench, and an electrically insulative layer coupled to the emitter trench and the gate trench and electrically isolating the gate trench from an electrically conductive layer. A contact opening in the electrically insulative layer extends into the emitter trench and the electrically conductive layer electrically couples with the emitter trench therethrough. A P surface doped (PSD) region and an N surface doped (NSD) region are each located between the electrically conductive layer and a plurality of semiconductor layers of the IGBT and between the gate trench and the emitter trench. The electrically conductive layer electrically couples to the plurality of semiconductor layers through the PSD region and/or the NSD region.

BACKGROUND

1. Technical Field

Aspects of this document relate generally to insulated gate bipolartransistors (IGBTs). Aspects of this document also relate generally toinjection enhanced gate transistors (IEGTs).

2. Background Art

Insulated gate bipolar transistors (IGBTs) are often used as switches.An IGBT generally combines an isolated gate field-effect transistor(FET), such as a metal-oxide-semiconductor FET (MOSFET) for the controlinput, with a bipolar power transistor switch, such as a bipolarjunction transistor (BJT). IGBTs are generally minority carrier deviceswith fast switching characteristics, high efficiency, high inputimpedance, and large bipolar current-carrying capability. IGBTs aregenerally used in medium to high power applications.

SUMMARY

Implementations of insulated gate bipolar transistors (IGBTs) mayinclude: a gate trench; an emitter trench; an electrically insulativelayer coupled to the emitter trench and to the gate trench andelectrically isolating the gate trench from an electrically conductivelayer, and; an opening in the electrically insulative layer that extendsinto the emitter trench and through which the electrically conductivelayer electrically couples with the emitter trench; wherein the gatetrench, the emitter trench, the electrically insulative layer and theelectrically conductive layer form at least a part of the insulated gatebipolar transistor (IGBT).

Implementations of IGBTs may include one, all, or any of the following:

A P surface doped (PSD) region and an N surface doped (NSD) region mayeach be located between the electrically conductive layer and aplurality of semiconductor layers of the IGBT.

The PSD region and the NSD region may substantially not overlap.

The PSD region and the NSD region may be located between the gate trenchand the emitter trench and the electrically conductive layer may beelectrically coupled to the plurality of semiconductor layers throughthe PSD region and/or the NSD region.

The IGBT may include a plurality of semiconductor layers including atleast a P+ layer, a P− layer, and an N− layer between the P+ layer andthe P− layer.

An N+ layer may be included between the P+ layer and the N− layer.

The gate trench and the emitter trench may each extend into at least twosemiconductor layers of the IGBT.

The gate trench may be electrically insulated from a plurality ofsemiconductor layers of the IGBT using an insulator.

The IGBT may further include a plurality of semiconductor layers and theemitter trench may not be electrically coupled with the plurality ofsemiconductor layers except through the electrically conductive layer.

Implementations of IGBTs may include: a gate trench; a first emittertrench; a second emitter trench; a diode trench; one or more inactivetrenches; an electrically insulative layer coupled to the gate trench,the first emitter trench, the second emitter trench, the diode trenchand the one or more inactive trenches, electrically isolating the gatetrench, the one or more inactive trenches, and the diode trench from anelectrically conductive layer; a first opening in the electricallyinsulative layer that extends into the first emitter trench and throughwhich the electrically conductive layer electrically couples with thefirst emitter trench, and; a second opening in the electricallyinsulative layer that extends into the second emitter trench and throughwhich the electrically conductive layer electrically couples with thesecond emitter trench.

Implementations of IGBTs may include one, all, or any of the following:

The electrically conductive layer may be electrically coupled to aplurality of semiconductor layers between the gate trench and the firstemitter trench through a P surface doped (PSD) region and/or an Nsurface doped (NSD) region.

The IGBT may include a P surface doped (PSD) region and an N surfacedoped (NSD) region, the PSD region and the NSD region each locatedbetween the electrically conductive layer and a plurality ofsemiconductor layers and also located between the gate trench and thefirst emitter trench.

A P surface doped (PSD) region may be located between the electricallyconductive layer and a plurality of semiconductor layers of the IGBT andmay also be located between the diode trench and the second emittertrench.

The gate trench and the diode trench may be electrically insulated froma plurality of semiconductor layers of the IGBT using an insulator.

The IGBT may include a plurality of semiconductor layers and the firstemitter trench and the second emitter trench may not be electricallycoupled with the plurality of semiconductor layers except through theelectrically conductive layer.

The IGBT may include a plurality of semiconductor layers including atleast a P+ layer, a P− layer, and an N− layer between the P+ layer andthe P− layer.

An N+ layer may be included between the P+ layer and the N− layer.

Implementations of methods of forming an IGBT may include: forming aplurality of semiconductor layers; forming a plurality of trenches inthe plurality of semiconductor layers by removing portions of theplurality of semiconductor layers; forming an electrically insulativecoating/layer on an inner wall of each of the plurality of trenches;substantially filling each of the plurality of trenches with a trenchmaterial to form at least one gate trench and at least one emittertrench; forming an N surface doped (NSD) region coupled with theplurality of semiconductor layers; forming an electrically insulativelayer over the plurality of semiconductor layers; removing a portion ofthe electrically insulative layer to create a contact opening in the atleast one emitter trench and simultaneously exposing the NSD region;forming a P surface doped (PSD) region coupled with the plurality ofsemiconductor layers, and; forming an electrically conductive layer overthe electrically insulative layer, wherein the electrically conductivelayer electrically couples with the at least one emitter trench throughthe contact opening.

Implementations of IGBTs may include one, all, or any of the following:

Forming the electrically conductive layer may include electricallycoupling the at least one emitter trench with the plurality ofsemiconductor layers through the NSD region and/or the PSD region.

Creating the contact opening may include removing a portion of thetrench material filling the at least one emitter trench to form anexposed surface of the trench material, and forming the electricallyconductive layer may include contacting the exposed surface with theelectrically conductive layer.

The foregoing and other aspects, features, and advantages will beapparent to those artisans of ordinary skill in the art from theDESCRIPTION and DRAWINGS, and from the CLAIMS.

BRIEF DESCRIPTION OF THE DRAWINGS

Implementations will hereinafter be described in conjunction with theappended drawings, where like designations denote like elements, and:

FIG. 1 is a cross-section view of conventional insulated gate bipolartransistor (IGBT);

FIG. 2 is a cross-section view of a conventional injection enhanced gatetransistor (IEGT);

FIG. 3 is a cross-section view of a conventional low gate capacitanceIEGT;

FIG. 4 is a cross-section view of an implementation of an IEGT;

FIG. 5 is a cross-section view of an implementation of an IGBT with anassociated mask pattern;

FIG. 6 is a cross-section view of an implementation of an IGBT with anassociated mask pattern;

FIG. 7 is a cross-section view of an implementation of a reverseconducting IGBT (RC-IGBT);

FIG. 8 is a cross-section view of a structure used in forming animplementation of an IGBT, the structure including a plurality ofsemiconductor layers;

FIG. 9 is a cross-section view of the structure of FIG. 8 with aplurality of trenches formed and an electrically insulative coatingadded;

FIG. 10 is a cross-section view of the structure of FIG. 9 with a trenchmaterial added;

FIG. 11 is a cross-section view of the structure of FIG. 10 afterremoval of a portion of the structure and addition of N surface doped(NSD) regions;

FIG. 12 is a cross-section view of the structure of FIG. 11 after theaddition of an electrically insulative layer, the creation of aplurality of contact openings, and the addition of P surface doped (PSD)regions;

FIG. 13 is a cross section view of the IEGT of FIG. 4 formed by addingan electrically conductive layer to the structure of FIG. 12, and;

FIG. 14 is a cross section view of the IEGT of FIG. 13 with aninjection/collector layer added.

DESCRIPTION

This disclosure, its aspects and implementations, are not limited to thespecific components, assembly procedures or method elements disclosedherein. Many additional components, assembly procedures and/or methodelements known in the art consistent with the intended insulated gatebipolar transistors (IGBTs) and related methods will become apparent foruse with particular implementations from this disclosure. Accordingly,for example, although particular implementations are disclosed, suchimplementations and implementing components may comprise any shape,size, style, type, model, version, measurement, concentration, material,quantity, method element, step, and/or the like as is known in the artfor such IGBTs and related methods, and implementing components andmethods, consistent with the intended operation and methods.

Referring now to FIG. 1, a cross-section view of a conventionalinsulated gate bipolar transistor (IGBT) 2 is shown. IGBT 2 is anon-punch through IGBT. A plurality of semiconductor layers are used toform the conventional IGBT, including an N− semiconductor layer 4 and aP− semiconductor layer 6 (channel layer). A pair of gate trenches 8 areshown, each having an inner wall 12 that is coated/layered with anelectrically insulative coating/layer 14 formed of an insulator 16,which may be SiO₂. The electrically insulative coating electricallyinsulates the gate trench from the plurality of semiconductor layers.The gate trenches are filled with a trench material 10 which may be anelectrical conductor, a metal, a doped polysilicon material, and thelike. A plurality of P surface doped (PSD) regions 22 are included,which may be P+ regions. In various implementations the PSD regions maybe referred to as “body” regions.

A plurality of N surface doped (NSD) regions 24 are also included, whichmay be N+ regions. An electrically insulative layer 18 is formed usingan insulator 20 which may be SiO₂. A plurality of contact openings 26are formed in the electrically insulative layer, each contact openingallowing an electrically conductive layer 28 to electrically couple witha PSD region and two NSD regions. The electrically conductive layer maybe formed of aluminum or any other electrically conductive material. Theelectrically insulative layer electrically isolates the gate trenchesfrom the electrically conductive layer. An injection/collectorsemiconductor layer, which may be a P+ semiconductor layer, may beincluded below (and coupled with) semiconductor layer 4.

Referring now to FIG. 2, a cross-section view of a conventionalinjection enhanced gate transistor (IEGT) 30 is shown. For the purposesof this disclosure, an IEGT is a variation of an IGBT. IEGT 30 is apunch-through IEGT due to the addition of an N+ buffer semiconductorlayer 32. An N− semiconductor layer 34 and P− semiconductor layer 36 areincluded and coupled to the semiconductor layer 32. Gate trenches 38 areformed and filled with a trench material 40, which may be any similarmaterial described above for IGBT 2. The inner wall 42 of each gatetrench has an electrically insulative coating/layer 44 formed of aninsulator 45, which may be SiO₂. The electrically insulative coating 44electrically insulates the gate trench 38 from the plurality ofsemiconductor layers 32, 34, 36. An electrically insulative layer 46,formed of an insulator 48, which may also be SiO₂, is included.Non-overlapping P+ PSD regions 50 and N+ NSD regions 52 are included.Contact openings 54 are formed in the electrically insulative layerwhich allow the electrically conductive layer 56, which may be aluminumor any other electrically conductive material, to electrically contactthe PSD and NSD regions. The electrically insulative layer 46electrically isolates the gate trenches 38 from the electricallyconductive layer 56. An injection/collector semiconductor layer may beincluded and coupled with the backside (bottom in the figure) ofsemiconductor layer 32, and may be a P+ layer.

Referring to FIG. 3, a cross-section view of a conventional low gatecapacitance IEGT 58 is shown. IEGT 58 is a punch through IEGT due to theaddition of an N+ buffer semiconductor layer 60. An N− semiconductorlayer 62 and P− semiconductor layer 64 are also included. Gate trenches66 and emitter trenches 70 are formed and filled with a trench material72, which may be any similar material described above for IGBT 2. Anelectrically insulative coating/layer 74 is included on the inner wall68 of each trench, formed of an insulator 76 which may be SiO₂. Theelectrically insulative coating electrically insulates the gate trenchfrom the plurality of semiconductor layers. An electrically insulativelayer 78, formed of insulator 80 (which may be SiO₂), is included, andhas a plurality of contact openings 86 formed therein. An electricallyconductive layer 88, which may be formed of aluminum or any otherelectrically conductive material, electrically contacts non-overlappingP+ PSD regions 82 and N+ NSD regions 84 through the contact openings.The electrically insulative layer electrically isolates the gatetrenches from the electrically conductive layer. An injection/collectorsemiconductor layer may be included below (and coupled with)semiconductor layer 60, and may be a P+ layer.

Referring now to FIG. 4, a narrow pitch low gate capacitance IEGT 90implementation is illustrated. IEGT 90 is a punch-through IGBT due tothe presence of an N+ buffer semiconductor layer 92. An N− semiconductorlayer 94 and P− semiconductor layer 96 are also included. In variousother implementations, however, an N− layer may not be included at all.A plurality of trenches 128 are formed in the semiconductor layers,including a plurality of emitter trenches 100 between a plurality ofgate trenches 98. Each trench is filled with a trench material 102. Thetrench material may be, by non-limiting example, a conductor, a metal, adoped polysilicon, any other trench material disclosed herein, and thelike. Each trench has an electrically insulative coating/layer 112 on aninner wall 106. The electrically insulative coating is formed of aninsulator, which in implementations is SiO₂, though other electricallyinsulative materials could be used in various implementations. Theelectrically insulative coating electrically insulates the gate trenchfrom the plurality of semiconductor layers 92, 94, 96.

A non-overlapping P+ PSD region 108 and N+ NSD region 110 are formedbetween each gate trench and emitter trench. An electrically insulativelayer 116 is formed of an insulator 118, which in implementations isSiO₂, though in other implementations other electrically insulativematerials may be used. Contact openings 132 are formed in theelectrically insulative layer. In the implementation illustrated, anexposed surface 104 of the trench material within each emitter trench100 is formed during the process of forming the contact openings 132. Anelectrically conductive layer 120 is deposited and electrically contactsthe exposed surface 104, along with the NSD and PSD regions. Theelectrically conductive layer may be formed of aluminum, but inimplementations other electrically conductive materials may be used.

The electrically insulative layer 116 electrically isolates the gatetrenches 98 from the electrically conductive layer 120. The contactopenings 132 extend into the emitter trenches 100, as can be seen. Aninjection/collector semiconductor layer may be included below, andcoupled with, the N+ buffer semiconductor layer 92, and theinjection/collector semiconductor layer may be a P+ layer. Theelectrically conductive layer 120 is electrically coupled with theplurality of semiconductor layers 92, 94, 96 through the PSD region 108and/or the NSD region 110. The emitter trenches 100 are not electricallycoupled with the plurality of semiconductor layers 92, 94, 96 exceptthrough the electrically conductive layer 120.

FIG. 5 shows a more extensive cross-section view of the IEGT 90illustrated in FIG. 4 and includes a mask pattern 122 that correspondswith IEGT 90. The mask pattern 122 shows a top view of various portionsof IEGT 90 including trenches 128, contact openings 132, and first NSDwidths 124. The NSD regions, as shown, may be wider when firstdeposited, having first NSD width 124, then may be reduced in size (suchas by removing some of the material through forming the contact openingor to form other elements of IEGT 90) to second NSD width 126 which isnarrower than first NSD width 124. In other implementations the NSDregions 110 may be originally formed to their intended final size. Eachtrench 128 has a trench width 130 as shown.

The specific material types disclosed here (P+, P−, N+, N−) and theirrespective positions within IEGT 90 could be varied to form variousother implementations of an IEGT/IGBT each of which includes a contactopening exposing an exposed surface of the emitter trench(es) to theelectrically conductive layer. Forming the contact opening 132 in such away that the trench material of the emitters is exposed, through exposedsurfaces 104, allows the trench material of the emitters to beelectrically coupled with a region of the semiconductor layers betweenthe gate trench and emitter trench when the electrically conductivematerial is deposited.

As can be seen by comparing FIG. 3 with FIG. 4, by designing the IEGT 90such that the electrically conductive layer is able to be in directcontact with the trench material of the emitter trenches, the contactopening 132 is able to be formed having the same width as contactopening 86, but the trenches 128 are now able to be spaced closertogether. The contact opening for IEGT 90 does not need to be spacedsmaller than the spacing between trench electrodes. In other words, thetrenches are able to be spaced closer together (more narrowly) than thewidth of the contact opening. Some existing processes and devices toform contact openings are limited in their ability to form smaller-widthcontact openings. Accordingly, allowing the contact opening to remainthe same dimension, while moving the trenches closer together, mayreduce die and package size, allowing IEGT 90 to take up less space thanIEGT 58, without having to utilize any different fabricationtools/devices/processes during the formation of the contact opening 132or the rest of IEGT 90.

Also, forming the trenches closer together and placing a contact openingof the same size as those previously used, but in such a way that itopens the emitter trench, may allow for a reduction in overall processsteps while using existing process tools and techniques. Implementationsof the new method may include removing an insulative material (such asan oxidation film) over the emitter trench, to expose the trenchmaterial, while at the same time removing an insulative materialseparating the trench material from a region in the plurality ofsemiconductor layers between the gate trench and emitter trench, duringformation of the contact opening. The method may also include whendepositing the electrically conductive layer, electrically coupling theelectrically conductive layer with the trench material of the emittertrench, and simultaneously electrically coupling the electricallyconductive layer with a region of the plurality of semiconductor layersbetween the gate trench and the emitter trench, and simultaneouslyelectrically coupling the trench material of the emitter trench with theregion of the plurality of semiconductor layers between the gate trenchand the emitter trench.

In some implementations the methods and structures described herein mayrely on the structure not needing to have a contact opening betweenneighboring emitter trenches, or, in other words, not needing to have acontact opening coupling the electrically conductive layer with theplurality of semiconductor layers between two neighboring emittertrenches. In some implementations the methods and structures describedherein may rely on there being little or no negative impacts fromreducing the spacing between neighboring emitter trenches and/orreducing the spacing between trenches in general.

Reference is now made to FIGS. 8-14, which representatively illustratevarious steps used in a method of forming an implementations of an IEGT90. FIG. 8 shows the semiconductor layers 92, 94, and 96 in astacked/layered configuration with an oxide layer 220 on top of (andcoupled with) semiconductor layer 96. Note that the semiconductor layer96 may not begin as a P− semiconductor layer but may be later altered tobe a P− semiconductor layer, as will be described hereafter. The oxidelayer may be formed of SiO₂ and may, by non-limiting example, be presentin some implementations to temporarily protect the rest of thesemiconductor layers from oxidation or other downstream processingoperations. The oxide layer may be formed by natural oxidation of thetop semiconductor layer 96 in various implementations. In otherimplementations, the oxide layer 220 may be a sacrificial oxide layer.

Various of the semiconductor layers may be formed by implantationfollowed by diffusion processing. For example, the N− layer, N+ layer,P+ layer, and P− layers may be formed by implanting dopants into asubstrate at high energy and then performing a diffusion step such as byusing a specified increased temperature for a specified amount of time.In various implementations all the layers could be implanted first, andthen diffused, and in other implementations there could be multiplediffusion steps, such as one after each implantation step. Some of theimplantation steps may involve high energy implantation to implant at agreater depth into the substrate than other implantation steps.

The IGBT/IEGT may include structures/characteristics of othersemiconductor devices such as a metal-oxide-silicon field-effecttransistor (MOSFET), a junction-gate field-effect transistor (JFET), andthe like. The IGBT/IEGT may, for example, include all of the elements ofa MOSFET or JFET and add other structures to form the IGBT/IEGT.Accordingly, the implantation and diffusion steps, and other fabricationsteps, may include processing steps and operations similar to those usedfor making these other devices.

Referring now to FIG. 9, the oxide layer 220 has been removed in aprevious processing steps and a plurality of trenches 128 are formedthrough an etching process. The electrically insulative coating/layer112 is then deposited over the structure (and accordingly on the innerwalls 106 of the trenches). As described above, the electricallyinsulative coating 112 comprises an insulator 114 which in theillustrated implementation is SiO₂ (this step may also involve theaddition and removal of sacrificial SiO₂), though other electricallyinsulative materials could be used. The SiO₂ (or other electricallyinsulating material) forms the gate oxide of the device. FIG. 10 showsthe structure following deposition of the trench material 102, which inthe implementation illustrated is doped polysilicon. FIG. 11 shows thestructure following etching back. The semiconductor layer 96 is thenimplanted (and a diffusion process is performed) so that semiconductorlayer 96 becomes a P well layer. The NSD regions 110 are thesubsequently created formed through implantation.

Referring to FIG. 12, an electrically insulative layer 116 is thenformed using an insulator 118, which in this case includesborophosphosilicate glass (BPSG). Contact openings 132 are then formedthrough etching processes to etch through the BPSG and then the SiO₂,forming an exposed surface 104 of the trench material 102 (and invarious implementations etching through some of the trench material, asillustrated in FIG. 12). The PSD regions 108 are then formed throughimplantation.

Referring to FIG. 13, the electrically conductive layer 120 is thendeposited/sputtered. In the implementation illustrated, the electricallyconductive layer 120 is made of aluminum, though in otherimplementations, any electrically conductive material could be used. Invarious implementations the aluminum upper surface may be etched, ajacket layer deposited, and the jacket layer etched. Referring to FIG.14, an injection/collector semiconductor layer 222 may then be depositedor formed on the backside, either through deposition or implantation,and may in this case be a P+ layer.

Various variations/process flows involving the above steps may be usedby the practitioner of ordinary skill in the art depending on thespecific configuration of an IEGT/IGBT and the functions of the variouslayers. In implementations a P+ layer may be an injecting/collectorlayer, an N+ layer may be a buffer layer (as has been described abovefor punch-through purposes), a N− layer may be a collector drift regionlayer, and so forth, though other configurations may be formed. Althoughthe steps above are described in a specific sequence, the specificsequence is only a representative example, and in other implementationsseveral of the same steps or other steps could be done in differentorder(s) to achieve the same IEGT/IGBT structure. Naturally, variousetching materials (such as masks) and processes, sacrificial oxides,photolithography/photoresist materials and processes, implantationmaterials (dopants) and processes, diffusion processes, washing/cleaningprocesses, and the like, may be included in the above mentioned process,which has generally been described in simplified format.

Referring now to FIG. 6, a cross-section view of an IGBT 134 is shown,along with a mask pattern 164 corresponding with the IGBT 134 (i.e., amask pattern used in making the IGBT 134). IGBT 134 includes an N−semiconductor layer 138, an N+ semiconductor layer 136 (which is abuffer layer, making this a punch-through IGBT), and a P− semiconductorlayer 140. A non-overlapping P+ PSD region 142 and N+ NSD region 144 arelocated between gate and emitter trenches, as shown. The gate trenches146 and emitter trenches 148 are organized so that there are two emittertrenches neighboring each gate trench but so that there are severalemitter trenches between each pair of gates. Each trench 168 is filledwith a trench material 150 which may be any of the aforementionedmaterials. The inner wall 152 of each trench includes an electricallyinsulative coating 154 of an insulator 156, which in implementations isSiO₂, though it could be formed of other insulative materials. Theelectrically insulative coating electrically insulates the gate trenchfrom the plurality of semiconductor layers.

An electrically insulative layer 158 is included and is formed of aninsulator 160, which may be SiO₂, BPSG, or some other insulativematerial. Contact openings 172 are formed in the electrically insulativelayer 158 which expose the PSD and NSD regions along with the trenchmaterial of some of the emitter trenches (though, as described earlier,the PSD and/or NSD regions could be formed after making the contactopenings). The electrically conductive layer 162, which may be formed ofaluminum or some other electrically conductive material, contacts thetrench material of some of the emitter trenches along with the NSD andPSD regions. The mask pattern 164 illustrates a top view of the maskpattern of the device which shows the various trenches 168 each having asimilar trench width 170. As described above with respect to otherimplementations, the NSD region may originally be a wider width and thenmay be narrowed down through etching or other material removaltechniques or the equivalent, to form a second NSD width 166, though inimplementations the NSD region may originally be formed to have thesecond NSD width.

The electrically insulative layer 158 electrically isolates the gatetrenches from the electrically conductive layer 162. The contactopenings 172 extend into the emitter trenches 148, as is illustrated. Aninjection/collector semiconductor layer may be formed at the bottom ofsemiconductor layer 136, and in implementations the injection/collectorsemiconductor layer may be a P+ layer. The electrically conductive layer162 is electrically coupled with the plurality of semiconductor layersthrough the PSD region and/or NSD region, as shown. The emitter trenchesare not electrically coupled with the plurality of semiconductor layersexcept through the electrically conductive layer.

FIG. 7 shows a representative example of a reverse conducting IGBT(RC-IGBT) 174. RC-IGBT 174 is a punch-through IGBT, having an N+ buffersemiconductor layer 176. RC-IGBT 174 incorporates an IGBT and afreewheeling diode (FWD). A P+ injection/collector semiconductor layer(injection/collector region) 178, N− semiconductor layer 180, and P−semiconductor layer 182 are included. Any of these layers/regions may beformed with techniques described herein or those known in the art orhereafter discovered. A plurality of trenches are formed, and each ofthese includes an electrically insulative coating 200 of an insulator202 (which in implementations is SiO₂, but which may be formed of otherelectrically insulative materials), on an inner wall 198. Theelectrically insulative coating electrically insulates the gatetrench(es), the diode trench(es) 192, and the inactive trenches 194 fromthe plurality of semiconductor layers, and locally isolates the emittertrenches from the semiconductor layers though the emitter trenches areelectrically coupled with the semiconductor layers through anelectrically conductive layer, as will be described hereafter. A trenchmaterial 196 fills each trench, which may include any of the trenchmaterials described herein.

A gate trench 188 is shown at the left of the figure, having a P+ PSDregion 184 and an N+ NSD region 186 between it and its nearest emittertrench 190 neighbors. The PSD and NSD regions are non-overlapping. Anumber of inactive trenches 194 are formed between emitter trenches.Below the inactive trenches a hole store area 218 is formed, which inimplementations may provide for faster operation, changing lowresistance by resulting conductivity modulation, high short circuittolerance due to the limited current that can pass by the invalidityregion, and/or other desirable operating conditions for the IGBT. Adiode trench 192 is shown at the right of the figure, having a PSDregion 184 between it and its nearest emitter trench neighbor. The gatetrench 188 and neighboring emitter trench 190 thus form an IGBT area212, the inactive trenches 194 form an invalidity area 214 having thehole store area below them, and the diode trench 192 and its neighboringemitter trench 190 form a diode area 216.

As with other IGBT/IEGTs described herein, an electrically insulativelayer 204 is formed of an insulator 206, which may be SiO₂, BPSG, orsome other electrically insulative material. Contact openings 208 areformed, which expose the trench material of active emitter trenches andwhich also allow an electrically conductive layer 210 to be inelectrical communication with the emitter trench material and also withthe NSD and PSD regions at the IGBT area. At the diode area the contactopening allows the electrically conductive layer to be in electricalcontact with the PSD region, the emitter trench material, and the P−semiconductor layer 182. In other implementations, an electricalinsulator could block the electrically conductive layer fromelectrically coupling with the P− semiconductor layer 182 proximate thediode trench so that the electrically conductive layer electricallycouples with the P− layer proximate the diode trench only through thenearby PSD region. In various implementations the electricallyconductive layer 210 is formed of aluminum, though in otherimplementations it may be formed of other electrically conductivematerials.

The electrically insulative layer electrically isolates the gatetrench(es), the inactive trenches, and the diode trench(es) from theelectrically conductive layer. The contact openings 208 extend into theemitter trenches 190, as can be seen, and the electrically conductivelayer is coupled with the plurality of semiconductor layers through thePSD region and/or the NSD region at the IGBT area. The emitter trenches190 are not electrically coupled with the plurality of semiconductorlayers except through the electrically conductive layer 210.

The P+ injection/collector region 178 may serve as an IGBT contact andthe bottommost portion of the N+ buffer semiconductor layer 176 mayserve as a diode contact.

In various implementations, the structures and methods described hereinmay result in the following characteristics for IEGTs/IGBTs comparedwith conventional IGBTs/IEGTs without requiring different or new waferprocess equipment to be used: a reduced saturation voltage (VCE(sat))reduced by, or by about, 30% (calculated by simulations); a reducedinput capacitance (C_(ies)) by about 20% (using emitter level trench);an over 30 kHZ power factor correction (PFC); lower capacitance; lowergate capacitance; lower loss when used as in inverter (about 35 Watts(W) at P_(OFF), about 18 W at P_(ON), and about 5 W at P_(VCE(sat)));lower loss when used as a PFC (about 45 W at P_(OFF), about 20 W atP_(ON), and about 10 W at P_(VCE(sat))); a reduced switching speed, and;longer short circuit withstand time (T_(SC)).

In places where the description above refers to particularimplementations of IGBTs and related methods and implementingcomponents, sub-components, methods and sub-methods, it should bereadily apparent that a number of modifications may be made withoutdeparting from the spirit thereof and that these implementations,implementing components, sub-components, methods and sub-methods may beapplied to other IGBTs and related methods.

1. An insulated gate bipolar transistor (IGBT), comprising: a gatetrench; an emitter trench; an electrically insulative layer coupled tothe emitter trench and to the gate trench and electrically isolating thegate trench from an electrically conductive layer, and; an opening inthe electrically insulative layer that extends into the emitter trenchand extends into a doped semiconductor layer located between the emittertrench and the gate trench; wherein the electrically conductive layerelectrically couples with the emitter trench through the opening in theelectrically insulative layer; and wherein the gate trench, the emittertrench, the electrically insulative layer and the electricallyconductive layer form at least a part of the insulated gate bipolartransistor (IGBT).
 2. The IGBT of claim 1, further comprising a Psurface doped (PSD) region and an N surface doped (NSD) region locatedbetween the electrically conductive layer and a plurality ofsemiconductor layers of the IGBT.
 3. The IGBT of claim 2, wherein thePSD region and the NSD region substantially do not overlap.
 4. The IGBTof claim 2, wherein the PSD region and the NSD region are locatedbetween the gate trench and the emitter trench and wherein theelectrically conductive layer is electrically coupled to the pluralityof semiconductor layers through one of the PSD region and the NSDregion.
 5. The IGBT of claim 1, wherein the IGBT further comprises aplurality of semiconductor layers comprising at least a P+ layer, a P−layer, and an N− layer between the P+ layer and the P− layer.
 6. TheIGBT of claim 5, further comprising an N+ layer between the P+ layer andthe N− layer.
 7. The IGBT of claim 1, wherein the gate trench and theemitter trench each extends into at least two semiconductor layers ofthe IGBT.
 8. The IGBT of claim 1, wherein the gate trench iselectrically insulated from a plurality of semiconductor layers of theIGBT using an insulator.
 9. The IGBT of claim 1, wherein the IGBTfurther comprises a plurality of semiconductor layers and wherein theemitter trench is not electrically coupled with the plurality ofsemiconductor layers except through the electrically conductive layer.10. The IGBT of claim 2, wherein the opening in the electricallyinsulative layer contacts an upper edge of the PSD region and contacts aside of the NSD region.